|
项目
|
技术标准
|
备注
|
|
层数
|
1-10层
|
8-10层可小批量生产
|
|
材料
|
CEM-3,FR-4
|
|
|
板厚
|
0.3mm-3.20mm (12mil-126mil)
|
|
|
最小芯板厚
|
0.1mm(4mil)
|
|
|
铜厚
|
1/2 oz min;3 oz max.
|
|
|
最小线宽/间距
|
0.1mm(4mil)
|
|
|
最小钻孔孔径
|
0.25mm(10mil)
|
|
|
最小冲孔孔径
|
0.9mm(35mil)
|
|
|
公差
|
钻孔孔位
|
±0.075mm(3mil)
|
|
|
线宽
|
±0.1mm(4mil)或线宽的±20%
|
|
|
孔径
|
PTH±0.1mm(4mil) NPTH±0.075mm(3mil)
|
|
|
外型公差
|
铣床±0.15MM(6mil) 冲床±0.10mm(4mil)
|
|
|
翘曲度
|
0.70%-1%
|
|
|
焊盘表面处理
|
Nickel/Gold Plating/Entek/Hot Air Leveling
|
|
|
绝缘电阻
|
10KΩ-20MΩ
|
|
|
传导电阻
|
< 50Ω
|
|
|
测试电压
|
150-300V
|
|
|
V刻
|
拼板尺寸
|
110×100mm(min.) 660×600mm(max.)
|
|
|
板厚
|
0.6mm(24mil)min.
|
|
|
保留厚度
|
0.3mm(12mil)min.
|
|
|
公差
|
±0.1mm(4mil)
|
|
|
槽宽
|
0.50mm(20mil)max.
|
|
|
槽到槽
|
10mm min.
|
|
|
槽到线
|
0.50mm(20mil)min.
|
|
|
槽
|
Slot size tol.>=2W公差
|
PTH L:±0.15mm(6mil)
W:±0.1mm(4mil)
|
Where:L=Slot length W=Slot width Min.drill bit size for multi-drill is 0.7mm
|
|
NPTH L:±0.125mm(5mil)
W:±0.1mm(4mil)
|
|
最小孔到圆形距离
|
PTH Hole:0.13mm(5mil)
|
|
|
NPTH Hole:0.18(7mil)
|
|
|
Registration Tolerance of Front/Back image
|
圆形偏差
|
0.075mm(3mil)
|
|
|
多层板
|
层间偏差
|
4 layers:0.15mm(6mil)max.
|
|
|
6 layers:0.025mm(10mil)max.
|
|
|
最小孔至内层圆形距离
|
0.25mm(10mil)
|
|
|
最小板边到内圆形距离
|
0.25mm(10mil)
|
|
|
板厚公差
|
4 layers:±0.13mm(5mil)
|
|
|
6 layers:±0.15mm(6mil)
|
|
|
特性阻抗
|
60 ohm±10%
|
|
